NEWS
MLOps and LLMOps – How do they differ?

By Aleksandra Sidorowicz, Machine Learning Engineer at Future Processing.

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NEWS
What is Generative AI and is it the Way to AIOps?

By Lori MacVittie, F5 Distinguished Engineer.

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NEWS
Efficient IT management: maximising output with minimal resources

By Jeremy Rafuse, Vice President & Head of Digital Workplace at GoTo.

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NEWS
Top trends to watch for in IT Service Management

By Phil Fox, Principal Customer Success Advocate at Adaptavist.

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NEWS
2023 IT Services Predictions and Trends

By Colin Blumenthal, Vice President, IT Services, Sharp Europe.

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NEWS
The end-to-end approach that unleashes the Moment of Service

By Marne Martin, President, IFS Service Management Business Unit (SMBU).

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NEWS
Taking the pain away from data centre admins

By Felix Berndt, Business Development Manager IIoT and Data Centers at Paessler AG.

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Videos

Edgar Van Essen, Managing Director, CCO and Partner for Switch Datacenters, outlines a dramatic decline in water use, new cooperative stakeholder models including green residual heat exchange networks, and a...
Ofir Bloch, VP at WalkMe, discusses the results of WalkMe’s fifth annual State of Digital Adoption report, which reveals that over half (54%) of workers bypassed AI tools and completed tasks manually at...
Shahar Belkin, Chief Evangelist at ZutaCore, explains how the company’s OmniTherm™ cold plate enables waterless two-phase cooling for manufacturers building servers with the NVIDIA RTX PRO 6000 Blackwell...
Data Centre World Frankfurt 2026

News

Digital Realty has opened its first data center in Barcelona, BCN1, located in the Sant Adrià de Besòs innovation area.
KROHNE announces a major commitment to the fast-growing data center sector by dedicating a significant portion of its annual production capacity to meet escalating demand. This strategic move is designed to...
Combining energy systems and data platforms into a single, integrated digital infrastructure model.
Gates Corporation has expanded its data centre cooling hose portfolio with larger diameter options designed to support high-flow, low-pressure requirements in AI, hyperscale, and HPC environments.